Home/Filings/8-K/0001213900-26-001966
8-K//Current report

Digi Power X Inc. 8-K

Accession 0001213900-26-001966

$DGXXCIK 0001854368other

Filed

Jan 6, 7:00 PM ET

Accepted

Jan 7, 8:00 AM ET

Size

238.2 KB

Accession

0001213900-26-001966

Research Summary

AI-generated summary of this filing

Updated

Digi Power X Inc. Announces LOI for AI & High-Performance Computing Partnership

What Happened

  • On January 7, 2026, Digi Power X Inc. (DGXX) filed a Current Report on Form 8‑K disclosing that it submitted a Material Change Report on SEDAR+ announcing a non-binding Letter of Intent (LOI) with Omnis Pleasants LLC.
  • The LOI is to pursue a strategic partnership to support large-scale artificial intelligence (AI) and high-performance computing (HPC) infrastructure. The Material Change Report is attached to the 8‑K as Exhibit 99.1. This disclosure was made under Regulation FD (Item 7.01).

Key Details

  • Date of disclosure: January 7, 2026.
  • Parties: Digi Power X Inc. and Omnis Pleasants LLC.
  • Nature: Non-binding Letter of Intent to explore a strategic partnership for AI and HPC infrastructure.
  • Filing: Material Change Report filed on SEDAR+ and provided to U.S. markets via Form 8‑K (Exhibit 99.1).

Why It Matters

  • The filing signals Digi Power X is exploring a strategic move into large-scale AI/HPC infrastructure, an area that may affect the company’s future operations and capital needs.
  • The LOI is non-binding and the filing contains no financial terms or final agreements; investors should not assume commitments or immediate financial impact.
  • Investors should watch for subsequent filings or announcements (definitive agreements, financial impacts, timelines) for material updates.