8-K//Current report
Digi Power X Inc. 8-K
Accession 0001213900-26-001966
$DGXXCIK 0001854368other
Filed
Jan 6, 7:00 PM ET
Accepted
Jan 7, 8:00 AM ET
Size
238.2 KB
Accession
0001213900-26-001966
Research Summary
AI-generated summary of this filing
Digi Power X Inc. Announces LOI for AI & High-Performance Computing Partnership
What Happened
- On January 7, 2026, Digi Power X Inc. (DGXX) filed a Current Report on Form 8‑K disclosing that it submitted a Material Change Report on SEDAR+ announcing a non-binding Letter of Intent (LOI) with Omnis Pleasants LLC.
- The LOI is to pursue a strategic partnership to support large-scale artificial intelligence (AI) and high-performance computing (HPC) infrastructure. The Material Change Report is attached to the 8‑K as Exhibit 99.1. This disclosure was made under Regulation FD (Item 7.01).
Key Details
- Date of disclosure: January 7, 2026.
- Parties: Digi Power X Inc. and Omnis Pleasants LLC.
- Nature: Non-binding Letter of Intent to explore a strategic partnership for AI and HPC infrastructure.
- Filing: Material Change Report filed on SEDAR+ and provided to U.S. markets via Form 8‑K (Exhibit 99.1).
Why It Matters
- The filing signals Digi Power X is exploring a strategic move into large-scale AI/HPC infrastructure, an area that may affect the company’s future operations and capital needs.
- The LOI is non-binding and the filing contains no financial terms or final agreements; investors should not assume commitments or immediate financial impact.
- Investors should watch for subsequent filings or announcements (definitive agreements, financial impacts, timelines) for material updates.
Documents
- 8-Kea0272060-8k_digi.htmPrimary
CURRENT REPORT
- EX-99.1ea027206001ex99-1_digi.htm
MATERIAL CHANGE REPORT DATED JANUARY 7, 2026
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GRAPHIC
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Issuer
Digi Power X Inc.
CIK 0001854368
Entity typeother
IncorporatedBritish Columbia, Canada
Related Parties
1- filerCIK 0001854368
Filing Metadata
- Form type
- 8-K
- Filed
- Jan 6, 7:00 PM ET
- Accepted
- Jan 7, 8:00 AM ET
- Size
- 238.2 KB