Printed Circuit Boards

Printed Circuit Boards (SIC 3672) span rigid, flexible, and HDI boards plus quick-turn prototyping and assembly services that anchor electronics design and production for OEMs across automotive, aerospace and defense, medical devices, telecom, consumer electronics, and industrial controls. Manufacturers balance tight tolerances, multilayer stackups, and compliant finishes while navigating supply chain volatility in copper laminates and specialty resins, strict environmental rules (RoHS, REACH), export controls, and reliability/IP risks tied to critical infrastructure. In 2024-2025 the sector is shaped by onshoring and CHIPS Act incentives, rising demand from EV platforms, AI/data-center hardware, and avionics, accelerated cycles toward miniaturization and high-speed materials, and investments in automation, additive fabrication, and greener chemistries to cut waste and energy use. OEMs and investors monitor margin pressure from input costs and capacity expansions alongside quality certifications (IPC, ISO) that remain table stakes. For the latest company moves and disclosures, you can view live SEC filings on Earnings Feed.

Source: Earnings Feed research · last fetched 11/23/2025