NXP Semiconductors N.V. 8-K

What Happened NXP Semiconductors N.V. reported on Feb 6, 2026 that its subsidiaries NXP B.V. and NXP Funding LLC amended and restated a revolving credit agreement with a syndicate of lenders, with Barclays Bank PLC as administrative agent. The facility provides US$3.0 billion of senior unsecured revolving commitments (including a US$200 million letters-of-credit sub‑facility) and is scheduled to mature on February 6, 2031. Borrowers can choose interest at Term SOFR plus a margin or a base rate plus a smaller margin; the agreement also includes customary covenants and a guaranty by NXP Semiconductors N.V. and NXP USA, Inc.

Key Details

• Facility size: US$3,000,000,000 total revolving commitments; US$200,000,000 sub‑facility for letters of credit.
• Closing / Maturity: Agreement dated and effective Feb 6, 2026; matures Feb 6, 2031.
• Pricing / fees: Interest at Term SOFR + 0.75%–1.25% or base rate + 0.00%–0.25%, based on NXP’s senior unsecured rating; commitment fee 0.065%–0.15% on undrawn commitments, paid quarterly.
• Covenant / guarantee: Requires a consolidated interest coverage ratio ≥ 3.00 to 1.00 each quarter; obligations are guaranteed by NXP Semiconductors N.V. and NXP USA, Inc.

Why It Matters This amendment secures multi-year liquidity and borrowing flexibility for NXP, allowing the company to support general corporate needs (including working capital and other lawful purposes) through at least 2031. Interest costs and quarterly commitment fees will vary with NXP’s credit rating, so the company’s rating level affects borrowing economics. The 3.00x interest coverage covenant is a material financial test investors should watch — if coverage falls below that threshold it could trigger defaults or restrictions. Overall, the agreement affects NXP’s short- and medium-term funding profile and provides a committed backstop for cash needs.